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By 15 February 2011 | Categories: news

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Although Intel might have dropped down Nokia's list of preferred partners, nothing has stopped them in announcing a number of interesting advancements to its mobile portfolio. These include a new 32 nm phone chip, as well as a forthcoming MeeGo-running tablet interface- all of course using the World Mobile Congress, currently underway in Barcelona, Spain, as platform. 
 
Silicone and integrated HSPA+ solution 
 
One of the more important announcements is Intel's 32 nm “Medfield” smartphone chip that will be introduced during 2011. According to Intel it will extend the performance benefits of its architecture into a low-power solution specifically designed for the smartphone market segment. The company's Mobile Communications (IMC) division is now shipping the world’s smallest, fully integrated HSPA+ solution with true 21 Mbps downlink and 11.5 Mbps in uplink for small form factor devices, while also announcing a new platform supporting Dual-SIM Dual-Standby (DSDS) operation for the emerging Dual SIM market.
 
Software advancements
 
Apart from the new smartphone chip and integrated HSPA+ solution, Intel also showcased more of its new MeeGo tablet interface that will be made available via Intel AppUp Developer Program. The MeeGo tablet user experience features an easy-to-use “object-oriented interface” with panels to display content and contacts. (Check out the demonstration video posted below for more details.) 
 
On the topic of the Intel and Nokia co-developed MeeGo OS, the chipmaker announced new MeeGo and AppUp software development tools and other programs to help developers port or create new applications as well as to tune and publish to the Intel AppUp center faster.
 
“Intel supports all major operating system environments, working closely with developers, service providers and manufacturers around the world to deliver premium, cross platfrom experiences,” said Renée James, senior vice president and general manager of Intel’s Software and Services Group.
 
“Our MeeGo tablet user experience shows the power and flexibility of MeeGo, and by adding new developer tools and programs we will accelerate our tablet strategy and MeeGo ecosystem momentum to enable faster time-to-market with innovative products for OEMS and service providers alike.”
 
MeeGo isn’t the only open-source OS the company supports though, as it announced its objective of delivering the industry’s fastest performance on Android with Intel Atom processor-based devices running Gingerbread (Android 2.3) and Honeycomb (Android 3.0), slated to come to market this year.
 
“By applying Intel’s world-class manufacturing and the most advanced silicon transistor technology to these new segments, we plan to deliver the best transistors and the highest performing, lowest power products that will enable continued innovation and new user experiences,” stated Anand Chandrasekher, Intel senior vice president and general manager of the company’s Ultra Mobility GroupChandrasekher.
 
“When these chips are combined with our support for leading mobile operating systems from Android to MeeGo, our proven ability to create broad ecosystem support, and our growing software and connectivity capabilities, I’m confident we will create exciting opportunities for our partners,” he continued. 
 
Silicone Hive
 
Intel further announced that it has purchased Silicon Hive, which will enable the company to bring better still imaging and multimedia video processor technology, compilers and software tools to its growing Atom processor portfolio. The Silicon Hive capabilities will assist Intel in delivering more differentiated Atom-processor based SoCs as multimedia and imaging grow in importance across the mobile smart device segments.

The company also revealed a new development by its researchers in radio frequency (RF) integration with new process technology that will make it possible to put three chips of a typical RF chipset onto a single chip. Using the most efficient transistors in the world, Intel researchers are able to achieve lower power and faster radio components compared to what is possible with current technology.

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